Probing Handler "PCP-103SL/303N"
Achieving probing compatible with multiple simultaneous measurements! Correcting misalignment after dicing.
We would like to introduce the "PCP-103SL/303N" handled by Plum Five Co., Ltd. Inspection of diced WLCSPs and packaged substrates (BGA, QFN, etc.) is realized through our unique probing method. By adopting our proprietary XY position correction function and profiling function, we have enabled probing that accommodates multiple simultaneous measurements by correcting the positional deviations caused by film tension after dicing and "distortion" or "deflection" from the dicer blade. 【Features】 ■ XY position correction probing ■ Multi-area alignment ■ Compatible with diced WLCSPs and packaged substrates (BGA, QFN, etc.) ■ Capable of inspection with chip reattachment to film frames ■ Employs a ring clamp method that is not affected by film sag *For more details, please refer to the PDF document or feel free to contact us.
- Company：プラムファイブ
- Price：Other
